"Origin" Flux-less Vacuum Soldering Reflow Oven

Mini Entry model

Mini is a very simple system designed for R&D and ideal for evaluation of formic acid reduction. Applications can be expanded by options.
    

VS2 Model

VS2 is a compact batch module designed for small-scale production from R&D and equipped with convenient automatic work transfer mechanism
  

MP2 Inline Model

MP2 is a mass-production system equipped with two process chambers
Inline type( heating + cooling). The process area in W380 x D310 x H100mm, large module can be mounted.  

  Formic Acid Reduction Reflow Vacuum Soldering System

Ideal for high-quality soldering with formic acid reduction and compression process.
Requires no flux and its cleaning
Creates no splash in process and results no viod
ADVANTAGE

1. REMOVAL OF SURFACE OXIDE IN FLUX LESS SOLDERING  
Ideal for high-quality soldering with formic acid reduction and compression process.
  
Formic acid reduction: In comparison with hydrogen, formic acid has excellent reduction effect
at low temperature. Application of formic acid removes surface oxide and obtains excellent wettability.

  
  
Safe operation of formic acid by closed system
  
■Formic acid decomposition unit:

Most of formic acid gas used in the reduction process is thermally decomposed. However a small amount remains.
Origin’s system completely decompose the formic acid gas. External exhaust treatment equipment is not required.





  
  

2.CONTROL OF VOID AND SOLDERING SPLASH BOTH BY VACUUM USE

 ■Compression process: By compressing voids, creates no splash in process and results no void.
On the other hand, in conventional defoamig process, solder splash occurs during vacuuming.
  
  
High speed heating under vacuum condition

Although it is difficult to control temperature without significant over-shoot during high speed process, especially under vacuum condition, Origin now offers systems capable of high speed and smooth temperature control with both vacuum and atmospheric condition.

■IR heater: Origin’s system adopts the directly heated by IR heater, to achieve a high-speed heating.
In contrast, typical hot plate is not suitable for high-speed heating, since the heat capacity of itself is large, and also there is large thermal resistance between the work under vacuum condition.

​ 

3. SYNERGY FROM FORMIC ACID REDUCTION AND COMPRESSION PROCESS

Pb-free soldering generally creates poor wettability, yet Origin’s process gives excellent soldering
Thin wafer demands higher level of soldering, yet Origin’s easily meets requirement..
  
Temperature profile

Programmable temperature profile settings. An example of the formic acid reduction and compression process.
  
  
Applications

Origin’s system is suitable for applications requiring clean soldering, flux residues and solder splashing is not allowed